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FIGURE 59.7 Weibull plots for a CBGA package cycled under two different loading conditions. Solid triangles and the dotted line are employed to indicate failures and associated failure distribution of a CBGA package cycled from 20 to 80 C (the least severe case presented in this figure). Solid squares and the dashed line indicate the failures and associated distribution for the identical package cycled from 0 to 100 C. Notice that an increase in the severity of the thermal cycle loading conditions (from 20 to 80 C to 0 to 100 C) creates an associated decrease in fatigue life. (Reprinted with permission from J. Lau, Ball Grid Array Technology, McGraw-Hill, 1995, p. 162.) asp.net ean 128 EAN - 128 ASP . NET Control - EAN - 128 barcode generator with free ...
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Barcode Rendering Framework Release.3.1.10729 components for Asp . Net , from http://barcoderender.codeplex.com/ The bar- code rendering framework quite ... Effect of different package types The differential strain imparted on solder joints in a ceramic flip-chip ball grid array (FCBGA) is quite different from that imparted on a thin small outline package (TSOP) package, for example As a result, the acceleration factors from one may not necessarily apply to the other The construction and effective CTE mismatch of the packages to be qualified must be as close as possible to the packages tested23 PWB thickness effect A thick board is likely to constrain a package more rigidly than a thin board Similarly, the number of layers in the board could significantly alter its overall stiffness Tests are frequently done on thinner boards because they are less costly and easier to fabricate. However, if the end-use condition entails the use of a thicker board, IPC9701 recommends performing the test on at least two different board thicknesses so that the data can be extrapolated to a range of board thicknesses The effect of board stiffness on lead-free packages appears to be similar to that on Pb/Sn packages, as shown in Sec 5833 of Chap 58 Cycling frequency As evidenced in the study performed by Pan et al 23 and by Clech,24 the temperature cycling frequency could have a significant effect on the reliability of the packages being tested Both the ramp rate and the dwell time affect the results Most of the damage accumulation during temperature cycling occurs in the hot dwell part of the cycle A reduction in dwell time reduces the amount of damage accumulated per cycle, which in turn means longer solder fatigue life. A long hot dwell would result in almost complete creep stress relaxation in the solder joints Consequently, some studies have indicated that a longer dwell time could result in eventual creep saturation25,26,27 Increasing the dwell time has shown some reduction in fatigue life in some studies, but the reduction was not very significant in some of those28 In addition to hot dwell time, ramp rate of heating and cooling also impacts the effective fatigue life of lead-free solder joints The amount of reduction in leadfree solder fatigue life due to ramp rate is a function of the package type Packages with higher effective CTE mismatched substrates (eg, CBGAs) are more sensitive to the ramp rate than packages with a less differential strain (eg, plastic ball grid arrays [PBGAs]). asp.net ean 128 Where can I find a font to generate EAN 128 bar-codes? - Stack ...
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