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For ENIG surface finish packages, the average force-to-failure value for the SnAgCu assemblies is almost three times that of the Pb/Sn assemblies. This is because the SnAgCu joints are stiffer than the Pb/Sn joints. Failure mode A is significantly more pervasive in the Pb/Sn assemblies but not as much in the SnAgCu assemblies. Thus, the propensity for brittle solder joint fracture is higher in the Pb/Sn assemblies with ENIG. The introduction of a small amount of copper in the Pb/Sn assemblies tends to increase the bending strength of the Pb/Sn assemblies by more than two times. The average force to failure with a solder-on-copper (SOC or SOP) surface finish is higher than that with ENIG, especially for the Pb/Sn solder joints. For the SnAgCu joints, there is a marginal increase in relative strength.

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Thus, mechanical bend strength is a function of the solder metallurgy and the surface finish used. These results indicate that SnAgCu solder joints are stiffer and have a higher average

FIGURE 59.12 Typical example of strain/strain rate limits as a function of PWB thickness for BGA solder joint interconnect failure. Note that the acceptable strain limit decreases with increasing strain rate. Note also that for a given strain rate, the maximum acceptable strain limit decreases as the PWB thickness decreases. (Reprinted with permission from Sun Microsystems, Inc.)

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force-to-failure value compared to Pb/Sn joints with the same surface finish. Another important factor in the bend strength of solder joints is the time after reflow, as shown in Fig. 59.1437. The results in Fig. 59.14 show the following:

For ENIG surface finish packages, Pb/Sn joints are more sensitive to time after reflow than SnAgCu joints. The average force-to-failure value of Pb/Sn joints with ENIG increased by more than 50 percent, whereas the average force-to-failure value of SnAgCu with ENIG did not change noticeably over time. For solder pre-coat (SOP) packages, the strength of Pb/Sn joints increased by slightly more than 10 percent over three weeks, whereas the strength of SnAgCu joints with SOP does not change noticeably over time.

Thus, mechanical bend strength is a function of the time after reflow along with solder metallurgy and surface finish. The underlying failure mechanisms have not been understood clearly enough to explain the dependence on time after reflow.

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FIGURE 17.7 Thermal contours of a component on an isolated section of PCB in two configurations: (a) with a solid thermal plane over the section of PCB, (b) with a 0.25 mm electrical isolation zone in the thermal plane. The isolation zone increased the component temperature by 33 C.

as a 1,000 mm span of Cu A model result showing the impact of an electrical path break in a thermal plane is shown in Fig 177 Here, a small 7 7 mm device with an exposed solder pad was intended to be cooled by a specific size of PCB area However, due to electrical constraints, a 025 mm electrical noise isolation break was placed halfway down the plane to produce a quiet island The PCB designer didn t think this would have much impact, but thermally, it cut the plane size by half As shown in the figure, there was a 29 C temperature drop across this single 025 mm break in the thermal plane and the component temperature increased by 33 C For best thermal performance, don t hamper thermal spreading in a thermal plane with continuous electrical isolation cuts.

Sometimes, the overall thermal performance of a PCB can be enhanced by carefully utilizing isolation cuts in the PCB to thermally segregate components that can afford to run at higher operating temperatures For example, if a series of power regulator components can operate at junction temperatures of 150 C but are dumping so much heat into the PCB that the digital components maximum junction temperatures are exceeded, it might be effective to cut the thermal plane between the power regulator components and digital portion of the PCB This design technique will cause the temperatures of the power components to rise, but will lower the temperatures of the digital components Of course, care must be taken to ensure the Cu connecting to the power regulation devices can carry the required current, so judicious application of this design technique is advised.

For the best spreading performance, the thickest possible Cu should be used in the construction of the thermal planes If a thermal plane is to be 05 oz Cu thickness (178 mm), it is wise to double this plane with another thermal plane, giving an effective 1 oz layer of Cu to spread the heat over the PCB surface Little additional advantage is gained when the thickness of all planes for spreading thermal energy is greater than 28 oz Cu 1733 Thermal Vias Thermal vias are simply those that connect the thermal lands or thermal collection plates to the thermal planes They are formed using the same processing techniques that are used for the PCB s electrical vias However, unlike electrical vias, the primary intent of a thermal via is that it conducts thermal energy efficiently into the thermal planes.

As such, a number of conditions should be met:.