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Conducting Effective International Webinars by Melanie Moeller As the daughter of a diplomat, I was exposed to diverse languages, behaviors, and cultural sensitivities One invaluable gift for me was learning to listen differently in order to pick up the subtleties of language, meaning, and intention of those from different cultures This experience has served me well as an international consultant and trainer, and online technology now allows me to work with those far and wide around the planet As a master trainer who certi es coaches and consultants in a number of tools, I teach online courses from my home of ce Several times a month, I speak with audiences of businesspeople all over the world Doing this with those from other cultures presents its own unique set of challenges.

Failure Mode Legend: Mode A: within the solder joint on the substrate side Mode B: pad lift on the substrate side Mode C: within the solder joint on the board side Mode D: pad lift on the board side

FIGURE 59.14 Data set comparing the force-to-failure value of Pb/Sn and Sn/Ag/Cu assemblies for two different surface finishes (ENIG and SOP) as a function of time after reflow. The histograms show a comparison of the different failure modes obtained in the bend tests. (Reprinted with permission from Kyocera SLC Technologies. / [2005] IEEE.)

59.3.3 Shock Testing As with bend testing, a shock test methodology is needed to simulate the shock conditions that a PCA may undergo during assembly, shipping, and handling conditions. Shock test conditions usually induce strain rates on the order of 100,000 me/sec. (microstrain per second), whereas typical monotonic bend test strains are on the order of 10,000 me/sec.Thus, the strains to failure under typical shock test conditions are lower than the strains to failure under typical bend test conditions. However, the failure modes could be different. Hence the need to characterize both bend and shock conditions. There are different classifications of typical shock conditions. For example, those experienced by handheld products (cell-phones, personal digital assistants [PDAs], etc.) are different from those experienced by typical network/server products.The former requires resistance to more stringent shock levels (~1500 G),40 whereas the latter requires resistance to shock levels on the order of ~500 G. An example of the typical shock test conditions applicable to these product categories is summarized in Table 59.6.

TABLE 59.6 Examples of Typical Shock Conditions Used for Different End-Use Environments (the Specific Conditions Tested Depend on the End Users) Typical field conditions Test parameters Acceleration peak (G) Pulse duration (ms) Handheld products 1,500 2,900 0.3 0.5 Network/server products 100 400 1.2 2

In addition to shock testing, several component suppliers also perform drop testing. For handheld products in particular, some suppliers prefer to perform board level drop testing instead. Details of the drop test method are outlined in JESD22-B111.41 Several component suppliers perform vibration testing in addition to shock testing to simulate shipping conditions. The design of the carrier tray or chassis in which the PWB is installed could significantly impact the reliability of printed circuit board assemblies (PCBAs). If the resonant frequency of the PCBA matches that of the chassis, and the mode shapes corresponding to the resonant frequency are such that they induce a strain above the critical solder joint failure strain, brittle fracture can occur. Accelerometers and strain gages should be used to characterize both mode shapes and strains in the PWB assemblies mounted on carrier trays or in chassis. The chassis design should be optimized to ensure that the strains that might impact the PCBAs are minimized, especially at the critical locations.Ways to do this include adding stiffeners, frames, and struts in the chassis at critical, high-strain locations. Finally, an additional way to mitigate shipping failures is to use shock indicators in the shipped product. A typical shock indicator changes color if the applied G values exceed a preset threshold. The use of a shock indicator in products can help in root cause analysis of failed parts.

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