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Ball Shear/Pull Testing Ball shear testers are employed to quantify the strength of the interface between a solder ball and its package prior to second-level attach Ball shear experiments can also be employed to assess the solder ball-package pad interface qualitatively This is accomplished by assessing the failure mode observed during a ball shear experiment However, certain failure modes are a function of the speed of the test The failure modes observed at relatively low speeds (00001 to 00006 m/sec) are different from those observed at high speeds (001 to 10 m/sec) In general, solder shear strength tends to increase with shear speed It is therefore important that failure mode characterization as a function of shear speed be performed before this technique can be used effectively as an inline monitoring tool to control the quality of substrate lots. birt pdf 417 Eclipse BIRT PDF417 Barcode Maker add-in makes PDF417 ...
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11 Dec 2012 ... Eclipse Birt Barcode Generator Add-In was developed exclusively by ... Supported matrix barcodes: QR Code, Data Matrix and PDF - 417 . To address this, JEDEC has published a revised version of the standard ball shear test to include high speed shear testing procedures (JESD22-B117A42) In addition to speed, a number of other factors could impact the fracture strength of solder joints, including surface finish, pad size, ball diameter, ball metallurgy, and pad construction All these need to be taken into account when comparing ball shear data across different packages Another important factor that could impact the force-to-failure and the failure modes induced is the time after reflow It is preferable to perform the test as early as possible after reflow43 In addition to the high-speed shear/pull test, other methodologies are also being explored to characterize the interface strength of solder joints One is a Charpy impact type of test44 This involves impacting the ball with a pendulum. birt pdf 417 how to render PDF417 Barcode image in BIRT - TarCode.com
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26 Dec 2012 ... What I what ask is that is there easy ways to generate PDF417 barcodes in BIRT . What I know now is to use a third party control like a BIRT ... The amount of energy imparted into the ball is estimated and the failure modes as a function of impact toughness are catalogued This test is a sort of mini-shock test designed to produce an effect comparable to the high-speed shear test Another methodology is the use of a hot pin pull test in which a heated pin is inserted into the solder ball, cooled, and then pulled at high speed Efforts are being made to measure the force to cause failure, so that pull/shear force or impact energy could be used as a metric to assess the strength or weakness of a joint 59341 Effect of Lead-Free Conversion Depending on the surface finish, the intermetallics formed in SnAgCu solders are different from those formed in Pb/Sn joints Refer to Sec 60311 in Chap 60 for more details. Preliminary results on high-speed pull/shear testing of SnAgCu joints indicate a higher interfacial fracture rate than Pb/Sn joint However, the SnAgCu joints exhibited moderately higher fracture strength43. FINITE ELEMENT ANALYSIS (FEA) birt pdf 417 Barcode Generator for BIRT | Generate barcodes in Eclipse BIRT ...
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Download PDF - 417 barcode generator for Java free trial package to create high quality PDF - 417 barcodes in Java class, iReport and BIRT . Here are some quick tips I ve learned over the years that make for an effective webinar with an international audience: Conduct a practice run to avoid and/or work out any technical glitches This is bene cial for both you and the participants Once they know how the technology works, they can focus on the content and their learning process E-mail materials to each participant ahead of time if possible Being able to review the materials ahead of time helps those for whom English is not their rst language become familiar with what will be covered Arrive early, so you can welcome the participants and present an initial slide so they know they are in the right place This is also an opportunity to be creative If appropriate, share something personal or professional about you that they can be reading while others are logging on. FEA is a numerical technique used to solve complex boundary value problems. It involves discretizing a complex geometry into smaller simpler geometries that can be represented by a set of differential equations. These equations can then be solved numerically to determine the deformation of the overall structure subjected to structural, thermal, or other loading conditions. FEA is a powerful numerical tool that has been used to assess the reliability of solder joints. FEA can be employed to: Estimate the fatigue life of a new package Compare reliabilities of different packaging options Assess impact on reliability due to material and design changes to the package Assess impact on reliability due to PWB material and design changes Determine changes in warpage due to package density and location FEA has been used effectively in simulating thermomechanical, bending, and shock conditions. This section focuses on the use of FEA to determine the lifetime of packages subjected to thermomechanical strains, and the use of bend test simulations to determine the factors that influence the bend strength of a package. 59.4.1 FEA for Thermomechanical Lifetime Assessment FEA lifetime assessments are typically broken down into four phases: Phase 1: global model Phase 2: local model Phase 3: single-joint lifetime assessment Phase 4: statistics-based package reliability estimate Figure 59.15 shows the interrelationships between these four phases. birt pdf 417 PDF - 417 Introduction, data, size, application, structure ...
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