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It is also common to weigh the reliability of joints other than the worst-case joint by considering the displacement of all joints with respect to the displacement of the worst-case joint46 This allows for the impact of DNP to be incorporated in the potential distribution of failures among joints at different locations 59415 Temperature-Dependent Material Properties As mentioned earlier, the aforementioned procedure is based on the assumption that the mechanical properties of the package material set do not change significantly with temperature There are certain packages, however, for which this technique is not applicable A typical example is an FCBGA package in which the underfill material has a glass transition temperature (Tg) around 70 to 100 C and undergoes several orders of magnitude change in modulus above the Tg Clearly, the properties of such a material are strongly dependent on temperature.

In such a case, the following procedure can be followed: 1 The global model is cooled from its stress-free temperature (which is usually the adhesive cure temperature) to the lowest temperature to which the package has been thermal cycled (0 C if a 0 to 100 C thermal profile is used) 2 Cut boundary interpolation is performed at small temperature steps (such as 5 or 10 C), recording the deformation of the nodes at each temperature step This information is stored in a set of data files 3 A submodel is created of the worst-case solder joint (the one that shows the most stress or deformation in the global model) The files stored in step 2 are applied as load boundary conditions on the nodes forming the submodel boundary at each temperature step Temperature-dependent material properties should be used in both models 4.

On completing the analysis, one can use the plastic work or strain accumulated to determine the expected fatigue life of the package based on the worst-case solder joint, as outlined in Phase 3 of the previous section If computer resources are available, a complete global model could be used to determine the plastic work or strain per solder joint However, this could be very time-consuming depending on the complexity of the package under consideration 59416 Impact on First-Level Interconnect In FCBGA-type packages using temperaturedependent material properties, failure resulting from solder joint fatigue may occur not.

(continued)

Lid Flip-chip Bumps Lid Adhesive Silicon Die Multi-Point Mesh Constraints Underfill Substrate BGA Copper Pad BGA Solder Ball PWB

along with h = cd h cd , then the Ricci tensor can be written as 1 2hcb 2h 2hca Rab = + a c W h ab a b 2 x b x c x x x x The Ricci scalar is given by R= 2 h cd Wh xc xd (13.6) (13.5)

FIGURE 59.18 Three-dimensional submodel detail showing the flip-chip bumps and underfill included in the model. The submodel can be used to determine the fatigue life of the flip-chip bumps and the BGA solder joint underneath at the same time.

only at the board-level interconnect but also at the first-level interconnect (between the silicon die and substrate). The flip-chip bumps are encapsulated by the underfill to improve their thermomechanical reliability by evenly distributing the CTE-mismatch-induced strains between the die and substrate. If the underfill material properties are such that the underfill softens drastically above its Tg, then there is a possibility that the flip-chip bumps may fail early during thermal cycling.52 To simulate this, the global-submodel approach outlined earlier can be used. In this case, the flip-chip bumps would also be incorporated in the submodel as shown in Fig 59.18. 59.4.2 FEA for Monotonic Bend Testing FEA simulations of monotonic bend testing involve a quarter-symmetry model of the assembly placed between anvils and deformed while monitoring the strains induced in the package, solder joint interconnects, and the PWB. The details of the quarter-symmetry model are shown in Fig. 59.19.

FIGURE 59.19 Three-dimensional quarter-symmetry model showing an FCBGA package mounted on a PWB between support anvils. Contact elements between the anvils and the PWB simulate the flexure of the PWB as one anvil set is moved vertically relative to the other. Detail A of the model is shown in Fig. 59.20.

Bend test FEA simulations achieve two primary objectives:

To determine the relationship between PWB strain and critical joint strain. This in turn helps bridge differences between the controlled conditions in which the bend testing is performed and the conditions in which bending occurs during assembly. To perform a comparative assessment of different packages. FEA can be used to derive solder joint strains from experimental PWB strain data for different test conditions.