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In Fig. 8.4, you can see curves for two FR-4 materials. The traditional FR-4 a 140 C Tg material, in this case has a decomposition temperature of 320 C by the 5 percent weight loss definition. The enhanced FR-4 has a decomposition temperature of 350 C by the 5 percent weight loss definition. Many standard high-Tg FR-4 materials actually have decomposition temperatures in the range of 290 310 C, whereas the 140 C Tg FR-4 materials generally have slightly higher Td values. The shaded regions indicate the peak temperature ranges for standard tin-lead assembly and lead-free assembly. A very common question is, if a PCB will be assembled at 260 C, and the material has a decomposition temperature of 310 320 C, then why wouldn t it be compatible with lead-free assembly The answer lies in the level of decomposition in the temperature ranges where assembly will take place. In the tin-lead temperature range, neither material exhibits a significant level of decomposition. However, in the lead-free assembly temperature range, the traditional FR-4 begins to exhibit 1.5-3 percent weight loss. This level of decomposition can compromise long-term reliability or result in defects such as delamination during assembly, particularly if multiple assembly cycles or rework cycles are performed. Figures 8.5 through 8.7 show ThermoGravimetric Analysis( TGA) curves assessing decomposition temperatures for three types of base material. These curves show different measurements for decomposition temperature. The value traditionally reported is the level at which 5 percent weight loss occurs, or where the mass is 95 percent of the starting sample mass. But as already discussed, this is a very high level of

nced FR-4

400

100 300.81 C 97.96% Weight (%)

297.83 C 297.02 C 98.96% 304.33 C 94.98%

70 0 100 200 300 400 500 Temperature ( C)

FIGURE 8.5 Decomposition curve for standard high-Tg FR-4.

(continued)

decomposition when considering PCB reliability. These curves also show 1 percent and 2 percent decomposition temperatures, as well as the onset decomposition temperature. The onset temperature extrapolates the linear portions of the curve. The point at which they intersect is reported as the onset temperature. Note that in Figs. 8.5 and 8.6 decomposition occurs very rapidly, while in Fig. 8.7 decomposition is more gradual, highlighted by the much bigger range between 1 percent, 2 percent, and 5 percent decomposition temperatures. With the material in Fig. 8.7, the 5 percent decomposition temperature would be reported as 405 C, even though some decomposition is beginning around 336 C.This highlights the need to understand not just the 5 percent decomposition temperature, but lower levels as well.

Time to Delamination Time to delamination refers to a specific test procedure used to measure how long a material will resist blistering or delamination at a specific temperature. The procedure utilizes a thermomechanical analyzer (TMA) in which a sample is heated to the specified temperature. The most common temperature used is 260 C. This test is commonly called a T260 test. Other temperatures are also used, such as 288 C or 300 C. Table 8.2 compares the performance of various material types. When reviewing this table, it is important to note that there can be large variation between similar materials across the manufacturers of these materials. T260 values can be affected by the specific resins and curing agents used in a given material as well as the differences in CTE values between the components in the sample. For example, note the lower T260 values reported for the 175 C epoxy versus the 140 C epoxy. Although the T260 value is shorter, thermal cycling tests typically show improved reliability with the 175 C Tg material because of the lower levels of thermal expansion that result with the higher-Tg material. The enhanced FR-4 materials, which use a different curing chemistry, generally exhibit

qvia = the via s thermal resistance ( C/W) k = the thermal conductivity of Cu (W/mm- C) diametervia = the via s drill diameter (mm) Tplating = the Cu plating thickness in the via (mm) lvia = the via s length between the thermal land and thermal spreading plane

Substituting some typical values such as a drill diameter of 0.3 mm, a plating thickness of 0.025 mm, a via length of 0.38 mm, and a thermal conductivity of 0.389 W/mm- C, the typical thermal resistance of a thermal via is found to be 45 C/W. Since a thermal resistance is analogous to an electrical resistance, equations for calculating parallel resistance can be used to calculate the effective

thermal resistance of a thermal via array. Using Eq. 17.4 below, a 4 4 array of vias is found to give a thermal resistance of 2.8 C/W. It is evident that the thermal performance of a component can be optimized with a relatively small number of thermal vias (see Eq. 17.4). 1 = Rtotal where

i =1

Putting these results together, we obtain 1 c ac c b = ac h c b ac b h 2 1 c c b = h c b b h 2 Now we take the trace by setting b c: 1 c c c = h c c c h 2 We are working in four dimensions. Therefore the trace of the Kronecker delta is c = 4. Setting = c c and h = h c c , we nd the trace to be c 1 1 c = h Tr c h = h (4) h = h 2h = h 2 2 (13.9)

(17.4)

Evaluating the thermal via resistance as a function of trace plating variability, a 0.015 mm thick plated via with the same dimensions as the preceding will have a thermal resistance of 73 C/W. Thus, the thermal performance of a PCB is sensitive to variations in the plating thickness of its thermal vias. To ensure thermal via performance, the plating thickness in the via should be checked. This is usually performed by parallel polishing down from the surface of the PCB rather than through a cross-sectional polishing of the via. When cross-sectioning a via, if sectioning plane does not intersect the exact center of the via, an incorrect plating thickness will be measured; this problem does not occur when parallel polishing into the depth of the PCB.