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Moreover, at higher speeds, there is an ever increasing need for reduction in signal delay between processors and the memories they communicate with.These processors could be microprocessors, network processors, programmable logic devices (PLDs) and application-specific integrated circuits (ASICs). This has given rise to the prominence of System-in-Package (SiP) modules which significantly reduce the delay between on-PWB memory and ASICs (Fig. 58.5).

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We can use this to replace P in (12.12) to obtain 1 a a = 3 ( + P) = 3 + t a a 3 Rearranging terms, we obtain da d = 4 a Following the procedure used for matter density, we integrate and ignore any constants of integration, which gives ln = 4 ln a = ln a 4 Therefore, we conclude that the energy density a 4 in the case of radiation. The density falls off faster than matter precisely because of the redshift we mentioned earlier. To close this section, we consider the vacuum energy density. The vacuum energy density is a constant, and therefore remains the same at all times. Since matter density and radiation energy density are decreasing as the universe expands but the vacuum energy density remains the same, eventually the universe will become dominated by vacuum energy. a = 4 a

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FIGURE 58.5 System-in-Package (SiP) Module. SiP modules help reduce signal delay between a processor and the memory devices it communicates with. This SiP has one processor in the middle, surrounded by four discrete memory packages, all on one module. The module is soldered to the PWB via the solder balls on the back side of the module substrate.

Make it safe. If the people in your audience are hesitant to ask questions, encourage them by asking each person to nd a partner and discuss any questions they might have. After two or three minutes, ask what questions were unanswered. This normally helps a shy audience to speak out. Take back the power. Remember that you have the most power with an audience at the beginning and end of a presentation. When the questionand-answer period has ended, give a brief wrap-up, and restate your conclusion. If you asked the audience to act, now is the time to repeat your request.

FIGURE 58.6 (a) Stacked-die package. Several dies are stacked within a single package and wirebonded to a single substrate. (b) Stacked package. Several wirebonded packages are stacked on top of each other with solder balls. (Courtesy of Amkor Technology, Inc.)

SiP modules can have more than eight memories communicating with a single ASIC.The ASIC package is typically a flip chip, whereas the memories could be CSPs, stacked packages or PBGAs. Stacked die and stacked package memories have also become more prevalent in applications where space is a constraint (Fig. 58.6). Stacking helps compact more memory within the same foot print and in applications where height is not a critical constraint, they help conserve valuable PWB real estate while at the same time providing greater integration and performance. But stacking technology raises its own unique set of reliability challenges. These challenges include heat dissipation from the multiple dies, reworkability and the reliability of the interconnects between the individual stacked dies or stacked packages.

Electronic packages are composed of complex materials that are assembled via intricate processes and then subjected to a wide range of service environments. It is crucial to note that both the die-packaging processes and surface-mount technologies can impart stresses and create residual stresses in the final packaged assembly that impacts its interconnect reliability.Assessing the reliability of package devices requires that all variables that can hinder or enhance reliability be considered.

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According to Wikipedia Code 39 is restricted to 43 characters.In order to generate it's encoding data I've used the following code:

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iText 7 : Bar codes
Barcodes.java .... setCode(code); Cell cell = new Cell().add(new Image(barcode. ... 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58

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java itext barcode code 39

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