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manufacturing processes. The strips should be at least 0.79 mm (0.032 in.) in width for testing after exposure to processing chemistries and 3.18 mm (0.125 in.) in width for the other tests. Metal cladding thickness can influence the measured peel strength and therefore it is accepted practice to use 1 oz. cladding, and if a thinner cladding is used, it may be plated up to 1 oz. thickness. One end of the strip is peeled back and attached to a load tester such as a tensile strength tester equipped with a load cell. The peel strength is calculated per the formula: lb./in. = Lm/Ws where Lm = Minimum load, and Ws = Measured width of the peel strip

TABLE 8.3 Densities of Common Base Material Types Material FR-4 Epoxy Filled FR-4 Epoxy High-Tg FR-4 Epoxy BT/Epoxy Blend Low Dk Epoxy Blend Cyanate Ester Polyimide APPE Density (g/cm3) 1.79 1.97 1.79 1.77 1.77 1.71 1.68 1.51

For testing after thermal stress, the sample is first floated on solder at 288 C for 10 seconds For testing after exposure to processing chemistries, the sample is exposed to a series of conditions First the sample is exposed to an organic stripper at 23 C for 75 seconds Historically, methylene chloride has been used, but due to environmental concerns, equivalents are now allowed After drying, the sample is then immersed in a solution of 10 grams/liter sodium hydroxide at 90 C for 5 minutes The sample is rinsed and then exposed to 10 grams/liter sulfuric acid and 30 grams/liter boric acid at 60 C for 30 minutesThe sample is again rinsed and dried and then immersed in a hot oil bath maintained at 220 C for 40 seconds.

Finally, the sample is immersed in a degreaser at 23 C for 75 seconds to remove the oil and then dried Testing at an elevated temperature may be performed by placing the sample in a hot fluid or in hot air while performing the peel strength measurements For FR-4 materials, 125 C is commonly used Table 84 shows 1 oz copper peel strength values in pounds per inch at various conditions for several common materials Note that polyimide, long used for its thermal reliability characteristics, exhibits the lowest peel strength values This illustrates that the absolute value of peel strength is not always the best indicator of quality or reliability.

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Measuring and monitoring of peel strengths for a given material type for comparison to its normal values can be used as a process control tool, an inspection criteria, or for failure analysis purposes, but in choosing a material, a higher peel strength does not necessarily imply higher reliability Last, if drum-side treated foil, also called reverse-treated foil, is used, the peel strength values will be lower because of the lower surface profile..

Serious progress in the density of flexible circuits was made during the second half of the 1990s, owing to the extreme miniaturization of electronic products. These products incorporate a new technical concept in the design of the circuits. They have a much higher density than traditional flexible circuits, with dimensions for traces, spaces, and via holes equivalent to those of rigid high-density interconnect (HDI) boards. (Details are described in the on Special Construction of Flexible Circuits.) They also have supplemental constructions on the circuit to allow higher termination capabilities. This type of construction is called an HDI flexible circuit (that is, a flexible circuit for high-density interconnects).

Specifications Table 61.3 shows typical requirements for interconnection in the end product, and the preferred specification of circuit parameters for the use of high-density flexible circuits.

TABLE 61.3 Common New Requirements for High-Density Flexible Circuits Requirements for end use High-density wiring Thin and light High-density SMT High-density connection Direct bonding Chip-on-flex, flip-chip High reliability for vibration For mechanical shock For wide-range heat cycle For salty moistures Preferred specification for flexible circuits Pitches smaller than 150 mm, via holes smaller than 150 mm in diameter Base 25 mm or thinner, conductor thinner than 12 mm Small opening on coverlay, tin or lead-free plating High dimensional accuracy (<0.3 mm diameter) High-density flying lead, pitch <100 mm High-density microbump array, pitch <100 mm High bond strength of conductors High bond strength between layers High heat resistance High insulation resistance

Portable electronic products are exposed to more severe conditions than ever before. As a result, they need higher reliability for the circuits as listed in Table 61.3. In the case of portable telephones, they are often carried in the owner s pocket, where they may be exposed to a variety of conditions, including continuous vibration, mechanical shock, temperature, humidity, pocket lint, and even perspiration. Other portable electronic products, such as digital cameras, PDAs, and notebook computers, could be exposed to similar conditions.