rdlc data matrix

rdlc data matrix

rdlc data matrix

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Several different types of adhesive materials can be used in flexible circuits depending on the application, except for the adhesive layer of copper laminates and film coverlays. The major applications are the bonding of stiffeners and multilayer constructions. Table 61.20 compares the materials. Pressure-sensitive adhesives (PSAs) provide a lowcost solution due to their simple application process. A problem of PSA is creep characteristics under mechanical stress, as PSA cannot maintain the exact positions of the stiffener boards under the stress. Thermosetting adhesives provide a reliable bonding between the layers, but they require a long processing time in a heat press with suitable press pad materials and impose a higher processing cost. Usually, the adhesive materials are supplied on or between separation sheets by rolled form. They should be kept in the refrigerators. The mechanical pretreatments are conducted with the separation sheets.

TABLE 61.20 Comparison of Adhesive Materials for Flexible Circuits Thermosetting epoxy and acrylic resin Reliability Bond strength Creep Soldering Application process Process temperature Material cost Total cost High High Small OK Complicated 160 180 C Low High Hot-melt-type polyimide resin High High Small OK Complicated >330 C High Very high Pressure-sensitive adhesives (PSAs) Acceptable Acceptable Large OK Simple Room temperature Low Low

When the PCB is thermally saturated and the component temperatures are still too high to be tolerated at the maximum obtainable system air velocity, other means of conducting heat from the PCB to even larger area system structures are required. The chassis of the system is often the largest surface area structure in the system, is exposed to the ambient air, and often makes a good sink for heat that cannot be dissipated by the PCB alone. Mechanisms to conduct heat into the chassis include chassis screws, gap fillers, connectors, and side rails. Sometimes, radio frequency (RF) shields that are appropriately connected to components can provide additional heat sinking.

Chassis Screws A properly designed chassis screw thermal sink connection in a PCB includes connection to the thermal spreading plane of the PCB, through hole plating, and a thermal contact area for the screw and stand-off sleeve to clamp onto. This configuration is shown in Fig. 17.10. The thermal screw should be as close to the hot electronic component as possible to minimize thermal resistance into the chassis. As well, the chassis where the thermal screw attaches should have a high thermal conductivity to spread the heat away from the screw. Preferably, the chassis should be made of metal. If a plastic chassis is used, molding a plate of aluminum (Al) into the plastic will improve its thermal heat spreading capability. A plastic chassis alone is usually a poor thermal spreader and may not provide substantial thermal performance enhancement.

FIGURE 17.10 Schematic of a chassis screw implementation for sinking heat to the chassis. The thermal screw mounts through a plated through via that is shorted to the thermal plane as shown. The thermal plane conducts heat from the thermal balls of the PBGA package.

One key to a successful toast is for everyone present to raise a glass and drink in unison. The key word here is unison, so before you start talking, make sure everyone has an appropriate drink. If you have a wedding planner or wait staff, they can

How much improvement might be expected from using the chassis of an enclosure for cooling This depends substantially on the enclosure construction and the location of the chassis screw with respect to the hot component. In one example, a device was cooled with a thermal screw that connected between a hard drive PCB and the hard drive enclosure. Connecting the device thermally to the hard disk drive resulted in a 10 percent thermal enhancement. 17.4.2 Gap Fillers It is sometimes not possible to use screws for conducting heat to the chassis. In other cases, large areas of high-power density might need to be sunk into the chassis. In these instances, another type of thermal conduction path is available that lends itself to conducting heat to the chassis: gap fillers. Gap fillers are thermal compounds that fill the gap between the PCB and chassis whose sole purpose is to conduct heat to the chassis. There are many different types of