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gap fillersThe most common is a soft, flexible silicone rubber material that has been filled with thermally conducting particles to enhance its bulk thermal conductivity Sometimes, thermally filled foams are used When the soft, compliant material is compressed between the PCB and chassis, it conforms to the protruding components on the PCB, making a good thermal connection Important criteria to consider in selecting elastomeric gap fill materials are the thickness needed, the thermal conductivity required, and the pliancy of the material A variety of materials with varying compositions are readily available on the market There is normally a trade-off between the pliancy of the material and the thermal conductivity, with higher thermal conductivity materials exhibiting less compliancy Plastic sacks filled with a thermal fluid are sometimes used as gap filler materials The fluid is usually optimized to produce convection in the gap of interest.

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The convection in the fluid can give an effective thermal conductivity that is substantially higher than the conductivity of the fluid alone 1743 Connectors Connectors can either provide a direct or indirect means of conducting heat from the PCB Direct conduction occurs in those system configurations where the PCB is plugged into an edge connector or back plane socket, or is held in place with an edge guide To take advantage of these direct connect thermal features, it is necessary to extend thermal planes into the areas where the connection or clamping occurs The connector, clamping, or edge guide should have as large a contact area as possible to optimize thermal conduction of heat from the low thermal conductivity PCB material In some military applications, the PCB is built around a thick Cu core that is clamped by the edge rail of the card cage.

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The thick Cu core provides very effective thermal conduction from the PCB into the edge rail, which is then cooled by a system of channels containing either moving air or moving water Indirect conduction of heat from the PCB can occur when cables are plugged into connectors on the PCB These indirect conduction paths are much harder to include accurately in systemlevel thermal analyses, but can provide some margin in a PCB thermal design Care must be taken, however, to ensure that these plug-in cables don t block critical airflow paths that would lead to overheating 1744 RF Shields RF shields are used over sensitive RF and analog circuits to minimize electrical interference with the circuit function or to minimize electrical radiation from the circuit into the surrounding environment RF shields are usually made of a thin metal which is soldered to ground on the PCB.

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In most instances, the RF shield is a continuous plate or box that encloses the circuits Unfortunately, this continuous box creates a dead zone in the air flow directly above the components within the box, degrading natural convection for those components To enhance the thermal performance of components within RF shields, perforations or meshing of the RF shield cage is recommended If these perforations are kept less than 1/10 the wavelength of the shielded electromagnetic radiation, the RF shield will function adequately to quiet the circuit and block out extraneous signals while allowing air flow through the shield to cool the interior components If additional steps are taken, the shield can be used to spread heat from hot components inside the shield over a larger section of the PCB, thereby maximizing convection and radiation cooling for the heated components Figure 17.

At the most fundamental level, one could say that geometry is described by the pythagorean theorem, which gives the distance between two points (see

11 shows a schematic of a shield over a stacked package component It is normally difficult to conduct heat from the top device in such a stack to the PCB, but when the RF shield is brought into contact with the top device, heat can conduct into the shield and down to the PCB It is suggested that the thermal connection between the shield and the electrical components be made with a thermal epoxy or thermal grease after the shield is soldered in place to avoid issues with mechanical tolerances.

Two issues have arisen regarding RoHS requirements for the flexible circuit materials: flameretardant molecules with bromine in adhesive resins, and heat resistance for high-temperature processing with lead-free soldering.Although the issue of bromine is not actually a part of the RoHS requirement, it has been linked to the general environmental issues of printed circuit materials and processes. Adhesiveless copper laminates can be the solution for the both of these problems because they do not use adhesive layers and have much higher heat resistance than adhesive-based

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