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made as uniform as possible Several ICT fixtures have push fingers on the top side, which push down on the board, countering the force of the test probes The use of push-pins or push-fingers on the top side of the board is not recommended Push fingers induce localized stress concentrations, resulting in high strain in their immediate vicinity If used, push fingers should not be placed close to package corners For some generic recommendations on ICT test point layout, refer to IPC735115 An alternative to push fingers is the use of a Milled City or zero-flex top plate on the top side This is basically a rigid metal plate which has a negative image of the entire board milled out Thus, as opposed to having several push fingers, the entire board is pressed against the Milled City plate.

If you are a rst-time presenter, consider these pointers as you build your presenting skills: Take a class This seems obvious, but if you haven t participated in an online event, sign up for one I m surprised by the number of my students who jump into teaching online without ever having learned online Read all the materials sent in advance Do all the prework, and start thinking about what you like and don t like about the way it s prepared Take a train-the-trainer course If your company offers training, take advantage of it If not, nd a course online Learn what works best from an experienced presenter Practice teaching before class begins Set up a test session using the same technology you ll use online Listen to your test course when you ve nished If that s not possible, practice with a recorder Study your recordings.

This significantly reduces local stress concentration, and could potentially be used to enable PCBAs to withstand more test points Milled City plates are expensive, but considering the cost of line stops and customer-related issues due to strain-induced failures in ICT, the non-recurring cost of the Milled City is a worthwhile investment 583121 Effect of Lead-Free Conversion The conversion to lead-free solder has given even more prominence to this issue With lead-free solders, a higher temperature organic solderability preservative (OSP) could be used As a result, it could take more force to establish contact with the test pads This translates to higher force applied to the PCBA Moreover, the effect of mechanical bending on lead-free solders is yet to be fully characterized Thus, there is a greater need to characterize the mechanical force applied on lead-free assemblies.

For the same applied force, the strain on thinner PWBs is higher than that on thick PWBs Thus, this is more critical on assemblies with relatively thin boards (<93 mils thick) However, depending on the package, warpage, surface finish, and number of test points, it could also be seen on thick boards Strain gage characterization should be performed on fixtures with actual boards, in order to verify that excessive strains are not applied on critical components In an effort to standardize strain characterization, the JEDEC/IPC 970425 test method was published in June 2005 This test method outlines the procedures and best practices relating to strain measurement in a manufacturing environment 58313 Package Design Parameters A key factor that impacts second-level interconnect reliability is the package itself.

Although the primary function of the package is to pass signals, power, and ground from the silicon device to the PWB, the package also provides protection for the silicon and enables a more robust interconnect than a direct chip attach The critical package design parameters which can have a significant impact on the reliability of the solder joints are discussed in this section 583131 Overall Dimensions and Distance from Neutral Point (DNP) Package size continues to grow as the number of I/Os increase to meet the demands of ever increasing IC functionalityAs IC complexity increases, memory is embedded in devices, while as silicon feature sizes decrease, I/O counts continue to be driven upward Package dimensions have surpassed 50 mm Package layer counts for both ceramic and plastic material sets continue to increase rapidly In addition to the solder joint geometry issues outlined in Sec 583.