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in turn could impact the reliability of the solder joints Therefore the effect on the overall stiffness should be characterized when using a single piece lid One characterization method is to perform Moir measurements on the free standing package, as a function of temperature Another variation of the standard heat spreader/stiffener design is the use of just a stiffener alone This is usually for bare die applications where the wattage of the chip is so high that the thermal resistance between the chip and the heat spreader is unacceptable In such cases, the stiffener is retained for stiffness and robustness, but the heat spreader is removed 583135 Mold Compound Selection The overmold compound used in plastic ball grid array (PBGA) packages could significantly impact the assembly yield and reliability of solder joints.

If the glass transition temperature (Tg) of the mold compound is significantly below the peak reflow temperature and if its modulus and CTE drastically change above its Tg, the package could warp significantly as it is heated As a result, when the package reaches liquidus, the effective warpage between the package and PWB could be such that solder joint opens/bridges could occur In large PBGA packages (>40 mm), it would be more effective to use an integrated heat spreader in the molded package to rigidize it and minimize excessive warpage Integrated heat spreaders are primarily used to improve thermal performance, but they also help rigidize the package for improved assembly yield With the conversion to lead-free materials, the mold compound selected needs to be such that it can withstand the higher reflow temperatures of lead-free assembly.

If the mechanical material properties of the mold compound (elastic modulus, CTE, and Tg) are not appropriately selected, the package could warp significantly at reflow temperatures and result in solder joint opens 583136 Underfill Material Selection The underfill material selected in flip chip BGA (FCBGA) packages could significantly impact the reliability of the board mounted package If the underfill material is too stiff, it would rigidize the assembly and thus transfer more strain to the silicon die This could result in delamination at any of the critical interfaces: underfill/ passivation, passivation/die, underfill/substrate, or within low-k layers On the other hand, if the underfill material is too soft, it could result in first level interconnect failure A less stiff underfill could also help reduce board level assembly warpage, which in turn helps the second-level interconnects.

Audience analysis is much tougher for an online group, but you can get good information from the registration forms If you are presenting as part of an ongoing class, check with previous presenters for any tips on working with the group..

Thus, the stiffness of the underfill selected should be optimized such that it does not lead to delamination or first-level interconnect failures9 In addition to stiffness, CTE, and Tg, there are several other factors that dictate the underfill material selected, such as thixotropy, viscosity, shrinkage, curing temperature, and curing time The choice of underfill material is also influenced by the conversion to lead-free For leadfree packages, even though there is a European exemption on the first level interconnects,27 many package suppliers are looking at using lead-free first level interconnects As a result, the underfill material selected has to be such that it can withstand the higher reflow temperatures, and has low shrinkage for the increased temperature range..

583137 Die/Package Aspect Ratio The size of the silicon die relative to the package body size could significantly impact the reliability of the package This is especially applicable to PBGA packages The larger the die relative to the package, the higher the CTE mismatchdriven strains imparted to the second level solder joints28 The degree of impact varies with package body size and absolute die size 583138 Package Substrate Material The choice of package substrate material can have a large impact on solder joint reliability Some substrates require employing solder ball alternatives (such as the ceramic solder column carriers shown in Fig 584) or even the elimination of a soldered solution due to interconnect reliability considerations A wealth of information regarding ceramic and plastic substrates can be found in the literature.

26,29,30 This section focuses on the impact of those materials on solder joint reliability The two key material properties of a substrate that impact interconnect reliability are modulus of elasticity (E) and coefficient of thermal expansion (CTE) Modulus of elasticity is defined as the ratio of stress to strain and can be used to describe a material s ability to resist deformation when subjected to an applied load CTE relates the change in length of material when heated or cooled and can be used to describe a material s deformation when subjected to temperature changes Reference 31 contains detailed discussions of modulus of elasticity and coefficient of thermal expansion A tremendous amount of material property data can be found in the literature26,29,30 Fig 5831 contains a sketch of a simplified solder joint interconnect.